Resources for Electromagnetic Coupling Metrology
Electromagnetic Coupling describes the interaction between the electrometric field and the mechanical structural factors such as design, manufacture, heat dissipation, and assembly. This field is important because every advance towards higher frequency, higher gain, higher density, faster response, higher pointing accuracy, and especially miniaturization makes considerations such as heat-electromagnetic couplings within and between the components more critical and complex.
At present, the theoretical system of electromechanical coupling of electronic equipment mainly includes:
- Field Coupling Theory: From the perspective of the physical field, this studies the coupling among the structural displacement, temperature, and electromagnetic fields to determine the comprehensive performance of electronic equipment in terms of electrical characteristics, volume, weight, reliability, cost, etc.
- Coupled Electromechanical-Circuit Theory: This analyses the influence of structural factors on the circuit performance in the presence of various structural errors and heating effects. The structural factors involve the circuit layout, structural parameters (thickness, line length, line length, line length, etc.), and manufacturing accuracy (coating, flatness, welding quality, etc.). The circuit performance includes the integrity, accuracy, and precision of the data or signal, power supply noise, ripple coefficient, resonant frequencies, and EMC, etc. Typical components are T/R modules, microwave signal circuit, and crystals.
- Influence of Material Properties: This assesses the effect of mechanical properties on electrical properties, and studies the change in physical properties under different frequencies and different materials. The electromagnetic properties of conventional materials may include magnetic permeability, electrical conductivity, dielectric constant, etc. Their structural and thermal properties may be elastic modulus and Poisson’s ratio, thermal expansion coefficient, thermal conductivity, etc. Of great interest are new types of materials – composite, intelligent, and metamaterials, which often have correspondingly new properties to study.
- Influence of Manufacturing Technology: This studies the effect of the technological process on structural and electromagnetic parameters, such as electromechanical coupling and surface roughness. The core elements of the process may include heating, coating, and welding. These determine the relationship among the errors, intermediate electrical parameters, and electrical performance.
- Integration of Structure and Control: This studies the coupling between the mechanical structure and the servo system performance, including the influence of structural factors such as friction, gap, inertia distribution, and supporting structure on the tracking performance of the servo system. It often involves servo systems, deployment mechanisms, adjustment mechanisms, and/or active reflectors.
- Multi-Scale Effect Mechanism: This studies the characteristics of the electrical, magnetic, thermal, mechanical parameters due to the varying electronic equipment structure over the micro, macro, and cross-scales. A typical application would be to understand the impact of surface roughness on high-precision waveguides, environment proofing, etc.
- International Conference on Computational Methods for Coupled Problems in Science and Engineering, http://congress.cimne.com/coupled2017/frontal/default.asp
- IEEE/ASME International Conferences on Advanced Intelligent Mechatronics, www.ai-mechatronics.com
- URSI General Assemblies and other meetings, www.ursi.org
- International Workshop on Electromechanical Coupling (IWEC 2017), Xian, China
- Institute of Electrical and Electronic Engineers (IEEE), http://www.ieee-uffc.org/frequency-control
- The European Community on Computational Methods in Applied Sciences (ECCOMAS) www.eccomas.org
- NASA Technical Reports Server (NTRS), https://ntrs.nasa.gov/search.jsp
Open Source Publications
- Deployable Structures Laboratory (DSL) – University of Cambridge http://www-civ.eng.cam.ac.uk/dsl/
- NASA’s Deep Space Network https://deepspace.jpl.nasa.gov/
- The Antenna Design Framework www.ema3d.com/adf-antenna-design-software
- Antennas Service and Education www.antenna-group.com/brands-and-operations/education-services.aspx
- Antennas http://www.antennas3.com/
- Numerical methods in transient and coupled problems http://trove.nla.gov.au/version/22148812
Books at Graduate Level and above
- Multifield Problems: state of the art, Anna-Margarete Sändig, W O Schiehlen,W L Wendland, 2000, Springer Press
- Coupled Field Problems, A. J. Kassab, M. H. Aliabadi, 2001, WIT Press
Refereed Professional Journals
- Mechatronics, https://www.journals.elsevier.com/mechatronics/
- IEEE/ASME Transactions on Mechatronics, http://www.ieee-asme-mechatronics.org/
- Structural and Multidisciplinary Optimization, http://www.springer.com/engineering/mechanics/journal/158
- COMSOL Community, https://www.comsol.com/community